• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention relates to an underfloor heating board (1), intended for installation in a wet room, comprising a board (1) with grooves (2), wherein the grooves (2) are arranged to accommodate a hose (4) for waterborne heat (4), that said floor heating board (1) is an MDF board and where said grooves (2) are arranged on a underside (IB) of said floor heating board (1). The invention also relates to a method for manufacturing said underfloor heating board.
    公开号:SE1450910A1
    申请号:SE1450910
    申请日:2014-07-23
    公开日:2016-01-24
    发明作者:Anders Kalleberg
    申请人:Dalab Dala Golvsystem Ab；
    IPC主号:
    专利说明:

    Thanks to the invention, underfloor heating is offered to a wet room where the underfloor heating is installed much faster and easier than with existing technology.
    According to one aspect of the invention, the underfloor heating board comprises grooves intended to accommodate water-borne heat and that said underfloor heating board consists of an MDF board, which gives the advantage that the heat is distributed in an efficient manner and the desired heating effect can be achieved without using any additional heat transfer. means, such as a sheet of metal arranged in the grooves, which saves both time and material consumption.
    According to another aspect of the invention, the grooves are arranged on the underside of the floor heating plate, which gives the advantage that a case can be arranged on the upper side of the floor heating plate.
    According to another aspect of the invention, the waterborne heat comprises a hose, which hose is preferably flexible, which means that it can be pressed into the groove on the underside of the floor heating plate.
    According to a further aspect of the invention, the underfloor heating board consists of a single board where the board has been manufactured with a built-in case, where the size of the board and the built-in case are adapted to the actual wet space where it is to be installed. This shortens the installation process and thus also the costs.
    According to another aspect of the invention, the grooves comprise an opening, which opening is smaller than a diameter of the groove and smaller than an outer diameter of the hose for the water-borne heat, which gives the advantage that when the hose has been arranged in the grooves it remains the track without detaching from it.
    According to another aspect of the invention, the opening of the groove runs along the entire groove on the underside of the underfloor heating plate, which makes it easy to manually poke / press the hose into the groove.
    BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail below with reference to the accompanying figures, in which: Fig. 1 shows an underfloor heating panel according to the invention seen from above, Fig. 2 shows an underfloor heating panel according to the invention seen from below, Fig. 3 shows a cross section of a groove in the floor heating plate according to the invention, Fig. 4 shows a cross-sectional view of a floor in a wet room comprising a floor heating plate according to the invention, Fig. 5 shows measured temperature in a floor heating plate according to prior art, Fig. 6 shows measured temperature in a floor heating plate according to the invention, and Fig. 7 shows the method steps in the manufacture of an underfloor heating board according to the invention.
    DETAILED DESCRIPTION OF THE DRAWINGS The following detailed description and the examples contained therein are for the purpose of describing and illustrating only certain embodiments of the invention and are not intended to limit the scope of the invention in any way.
    Figure 1 shows an underfloor heating board 1 according to the invention in a top view. The underfloor heating board 1 comprises a top side 1A and a through hole 3 intended for WC or other plumbing. The floor heating board 1 has a length L and a width B where the length L and the width B are adapted to the wet space where the floor heating board 1 is to be installed.
    The underfloor heating board 1 also has a built-in case against said hole 3. By built-in case is meant that the underfloor heating board 1 has a slope from its outer edges towards said hole 3 so that water or other liquid flows towards the hole 3 if / when it ends up on the floor.
    The lines on the underfloor heating board 1 in figure 1, which run from the corners towards the hole 3, should illustrate that the underfloor heating board 1 has a slope from the outer edges of the board 1 down to the hole 3. The underfloor heating board 1 is preferably an MDF board (Medium Density Fibreboard). a dense wood fiber board, which in tests has been shown to dissipate heat very well. Thanks to the use of an MDF board, a desired heating effect, comfort heat, is achieved, often in the range 20-28 ° C, more preferably in the range 22-26 ° C, without having to use any form of additional heat transfer means, such as a metal sheet. Thanks to this, material consumption and working hours can be kept down (for example, reduced drying time compared to if the floor is floated) and thus also costs. The underfloor heating board 1 preferably has a thickness Ti in the range 15-50 mm, more preferably in the range 18-40 mm and most preferably in the range 22-35 mm.
    Figure 2 shows an underside 1B of the floor heating board 1 according to the invention. The underside 1B comprises grooves 2, preferably milled grooves 2 which run back and forth in meander form. An advantage of using MDF in the underfloor heating board 1 is that it is possible to mill out the grooves 2 and get a good precision on the grooves 2, which is difficult 10 if another wooden board is used. Those skilled in the art will appreciate that the grooves 2 can also be arranged in other patterns than what is shown in this particular example, but preferably the grooves 2 are arranged with a distance X between them. The distance X is in the range 30-180 mm, more preferably in the range 40-170 mm and most preferably in the range 50-160 mm. The shape / pattern you arrange on the grooves 2 and the mutual distance X between them are adapted to the desired heating effect. The above-mentioned distance X is preferable as otherwise there will be an uneven distribution of the heat if the grooves 2 are arranged further apart or too close to each other.
    Figure 3 shows a cross section of a groove 2 in the underfloor heating board 1 according to the invention.
    The groove 2 has a diameter D in the range 5-40 mm, more preferably in the range 6-30 mm and most preferably in the range 7-16 mm. The groove 2 also comprises an opening 9, which opening runs parallel to the underside 1B of the underfloor heating plate, along the entire length of the groove 2. In the groove 2 a hose 4 is arranged, for the water-borne heat, by the hose 4 being manually inserted into the groove 2 via the opening 9 which runs along the entire groove 2. The hose is preferably flexible to enable insertion of it into the groove 2, further so the hose is preferably made of a plastic material.
    The hose 4 has an outer diameter d which is smaller than the diameter D of the groove but larger than said opening 9. Since said opening 9 is smaller than the outer diameter d of the hose, it gives the advantage that when the hose 4 has been arranged in the groove 2 and the floor heating plate 1 is turned right position, the hose 4 remains in the groove 2 without falling out. Due to this the working step is avoided that a board or the like must be arranged on the underside 1B of the floor heating board to keep the hose 4 in the groove 2. Said hose 4 is flexible and thanks to this the hose 4 can be pressed into the groove 2 even though the outer diameter d is larger than the opening 9. When the hose 4 is pressed down into the groove 2, the hose is compressed and becomes smaller, and when the hose is inside the cavity / groove 2, it expands to its normal size again and has advantageous contact with the inner walls of the groove. The outer diameter d of the hose is preferably as close to the diameter D of the groove as possible, as the best heat transfer between hose 4 and floor heating plate 1 is achieved when the hose 4 is in contact with the floor heating plate 1 in the groove 2. Is the outer diameter d of the hose much smaller than the groove diameter D, but larger than the groove opening 9, it also works, but you do not achieve as good heat transfer. When manufacturing the grooves 2, the edges on each side of the opening 9 are made so thick / stable that the hose 4 is allowed to be pressed down into the groove 2 without the edges being damaged.
    In wet rooms, the parts of the floor that are regularly exposed to water should lean towards a drain, as an important function of a wet room is to be able to transport away 10 water. The floor slope / fall can be achieved in different ways and a common way is to use float putty on the load-bearing subfloor. I / lan float putty in such a way that the floor is thickest in the parts that are furthest away, for example a floor drain, and the floor becomes thinner and thinner closer to the floor drain so that a slope is created towards the floor drain which causes water to flow towards the hole. A major advantage of using an underfloor heating board 1 according to the invention is that you do not have to putty float and thereby save on drying time of about 18 hours. To create a fall on the floor, the floor heating plate 1 according to the invention has a built-in fall which minimizes the work and the drying time during installation. Figure 2 shows how an inlet 20 and an outlet 21 for the water-borne heat 4 have been arranged in connection with each other. Figure 2 shows the underside 1B of the floor heating plate 1 with groove 2 after the milling out and where the hose 4 is arranged in the grooves 2 and it is seen how the hose protrudes outside the plate 1 at the inlet 20 and outlet 21 of the groove 2.
    The underfloor heating board 1 according to the invention is adapted to the size of the wet space in which it is to be installed and to the desired case. The maximum size of the underfloor heating board 1 is preferably 2600x1830 mm due to practical reasons such as that it should be possible to handle the board and that the cutter should be able to process the board. In cases where the wet space is larger than 2600x1830 mm, two or more underfloor heating boards 1 are used. When two or more underfloor heating boards 1 are used, these boards are arranged next to each other by gluing next to each other on a subfloor 7.
    To manufacture the desired properties of the floor heating plate 1, a computer-controlled cutter is used where a computer program ensures that the slope of the floor heating plate 1 is exact, regardless of the size of the wet space. You program in where on the floor heating plate 1 you want to have inlet / outlet 21, 22 and where the hole 3 should be. Additional input data can be the floor heating plate length L, width B, thickness T and the desired case. The computer program then calculates how the computer-controlled milling cutter should mill out the grooves 2 on the underside 1B of the floor heating plate so that the grooves 2 have the same distance X between them. The computer-controlled cutter also uses the input input to mill on the upper side 1A of the underfloor heating board the board 1 so that it is thickest at its outer edges and that the board becomes thinner and thinner towards the hole 3 so that a fall is created towards the hole 3. The milled material is used for heating of premises. The manufacture of an underfloor heating board 1 according to the invention can be said to follow the method steps - providing an I / IDF board 10 - input of data such as, the length, width, thickness of the board and the desired case on the board 11 - input of data on where inlet and outlet arranged 10 10 - milling out of grooves and through holes 13 - milling away of material so that the desired fall is achieved on the top side of the disc 14 - pressing in / pressing in a flexible hose in the grooves 15.
    Those skilled in the art will appreciate that some of the method steps above may change locations without departing from the spirit of the invention. For example, the case on the top of the disc can be milled before the grooves are milled out on the underside.
    Thanks to the underfloor heating board 1 according to the invention, underfloor heating can thus be offered where the underfloor heating consists of a single underfloor heating board 1 which is adapted to the desired dimensions of the room where it is to be installed and requirements for slope / fall. Although it is an advantage to only need to have a single underfloor heating panel 1, the person skilled in the art realizes that it is of course also possible to install a plurality of underfloor heating panels 1 according to the invention in a wet room.
    When installing an underfloor heating board 1 according to the invention, a flat subfloor 7 (see figure 4), such as of wood or chipboard, is arranged on top of a floor joist 8 in the wet room. The hose 4 is arranged in the grooves 2 on the underside 1B of the disc 1. Figure 2 shows how the inlet / outlet 20, 21 for the water-borne heat 4 are arranged in connection with each other. Where on the disc 1 the inlet / outlet 20, 21 is arranged is advantageously adapted in the vicinity of where in the wet space the connection is located. When the hose 4 is arranged in the grooves 2, the floor heating plate 1 is glued to the subfloor 7 and advantageously also screwed through pre-drilled holes. An approved sealing layer mat 6 or the like is then arranged on top of the floor heating plate 1. Finally, a plastic mat, tiles 5 or similar are arranged on top of the waterproofing layer mat 6 and the floor heating is switched on.
    The applicant has performed tests on the underfloor heating board 1 according to the invention in DALAB's premises Mockfjärd. The test was performed with an IR camera at a room temperature of 20 ° C.
    Figure 6 shows the test result when electric heating coils are used in the grooves 2 on the underside 1B of the floor heating plate. I / Ian can see that the heat is unevenly distributed over the floor heating board 1 with a variation between 22-28 ° C where the lightest parts correspond to a temperature of about 28 ° C and the darkest parts correspond to a temperature of about 22 ° C. The brightest / warmest portions were measured in the area where the electric heating coils are arranged. Figure 7 shows the test result when water-borne heat is instead used in an underfloor heating board 1 according to the invention. The lightest parts here correspond to a temperature of about 24 ° C and the darkest parts correspond to a temperature of about 22 ° C. No clear parts can be seen here where it is warmer, but the test result shows that the 10 heat is significantly more evenly distributed over the disc 1 with a temperature variation between 22-24 ° C. A combination of I / IDF board and water-borne heat thus provides great advantages in terms of heat distribution. In addition to the fact that MDF has been shown to conduct water-borne heat well, it is easy to mill out / remove material with good precision, is good in wet areas as it swells / changes shape minimally in humid environments with high humidity.
    Those skilled in the art will appreciate that the invention is not limited to the embodiments described above, but that variations may occur without departing from the spirit of the invention. For example, the underfloor heating board can be used for both new construction and renovation.
    It is also understood that the water-borne heat can be conducted in other than just a hose made of plastic, as the important thing is that what transports the water-borne heat is flexible and can be pressed down into the grooves.
    权利要求:
    Claims (1)
    [1]
    A floor heating plate (1), intended for installation in a wet room, comprising a plate (1) with grooves (2), the grooves (2) being arranged to accommodate water-borne heat (4), characterized in that said underfloor heating board (1) is an MDF board and wherein said grooves (2) are arranged on a underside (1B) of said underfloor heating board (1). Underfloor heating board according to claim 1, characterized in that said water-borne heat (4) comprises a hose (4), which hose (4) is preferably flexible. Underfloor heating board according to claim 1 or 2, characterized in that said underfloor heating board (1) comprises a built-in case on a top side (1A) of said underfloor heating board (1). Underfloor heating board according to any one of claims 1-3, characterized in that said underfloor heating board (1) comprises a through hole (3) for plumbing. Underfloor heating board according to any one of claims 1-4, characterized in that said groove (2) comprises an opening (9), which opening (9) is smaller than a diameter (D) of the groove (2). Underfloor heating board according to claim 5, characterized in that said opening (9) runs along the entire groove (2) on the underside (1B) of the underfloor heating board (1) - Underfloor heating board according to claim 2, characterized in that said hose (4) has an outer diameter ( d) which is larger than said opening (9) and smaller than the diameter of the groove (D). Underfloor heating board according to claim 5, characterized in that the diameter (D) of the groove is in the range 5-40 mm, more preferably the diameter (D) is in the range 6-30 mm and most preferably the diameter (D) is in the range 7-16 mm. Underfloor heating system according to claims 1-8, characterized in that the groove (2) comprises water-borne heat (4) comprising a hose. Method for manufacturing an underfloor heating board (1) according to claims 1-9, characterized in that the method comprises the steps of: - providing an MDF board (10) - entering data such as length (L), width (B), thickness (T ), as well as the desired case of finished underfloor heating board, in a computer-controlled cutter (11) 10 15 20 25 30 35 11. - enter data on where on the board inlet (20) and outlet (21) are to be placed (12) - let the computer-controlled milling from input data mill out of grooves (2) on a underside (1B) of the floor heating plate (1) and a through hole (3) (13) - let the data-controlled milling machine from input data mill away material from an upper side (1A) of the floor heating plate (1) until the desired fall is achieved from the outer edges of the disc down towards the hole (3) (14). Method of manufacturing an underfloor heating board according to claim 10, characterized in that the method comprises the step of: - pressing / pressing a flexible hose (4) into the groove (2) on the underside (1B) (15) of the underfloor heating board.
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    同族专利:
    公开号 | 公开日
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    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
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    JP3826244B2|1998-03-17|2006-09-27|朝日ウッドテック株式会社|Heated floor panel|
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    DE10002373A1|1999-01-22|2000-08-17|Peter H Butscher|Panel for underfloor heating and cooling has a prepared groove to hold the cooling or heating pipe|
    DE19920457A1|1999-02-18|2000-08-24|Si Solarheizungssysteme Gmbh S|Method for producing a building plate for floors and walls involves provision of channels with overhung sections for accommodation of piping carrying heating or cooling media|
    DE29911861U1|1999-06-26|2000-03-30|Wkk Energieplan Gmbh|Heating element and floor and / or wall and / or ceiling heating from such heating elements|
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    DE202005002322U1|2005-02-14|2005-04-07|Lindner Ag|Base structure for underfloor heating comprises plates placed on supports with each plate having grooves for heating lines|
    DE202009011156U1|2009-08-18|2011-01-05|Viega Gmbh & Co. Kg|Air base plate|
    EA032677B1|2012-05-16|2019-07-31|Грейд Груп Ас|System for drainage of fluids from substantially flat surfaces intended for covering a floor or a roof|
    EP2672187A1|2012-06-05|2013-12-11|Jackon Insulation GmbH|Heated shower floor|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    SE1450910A|SE539903C2|2014-07-23|2014-07-23|Underfloor heating disc, underfloor heating system and method of manufacturing an underfloor heating disc|SE1450910A| SE539903C2|2014-07-23|2014-07-23|Underfloor heating disc, underfloor heating system and method of manufacturing an underfloor heating disc|
    EP15176816.5A| EP2977686B1|2014-07-23|2015-07-15|Underfloor heating board|
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